Surface Current flow of package mounted on a Rogers Board
High Frequency Surface Mount Technology (SMT) packages
Cost effective solutions for Hermetic and Non-hermetic packages
Custom impedance matching for MMICs
Technology enabling smaller RF modules
- High Frequency Multilayer RF Boards
- RF Impedance matched material (i.e. RO4003)
- Using blind, buried and thru vias
- Our proprietary grounding and shielding designs
- Heat spreading material integration
- HTCC and Thick/Thin film ceramic materials
- LTCC
- Buried components
- Cavities for MMIC/die and passives
Contact us with your requirements and our highly experienced team of engineers can quickly identify and implement innovative solutions using latest technology to improve performance and reduce cost.